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Benefit for Automotive grade small form factor devices
1.Low failure rate
Failure rate; 1/30 of mold resin package *Based on Nuvoton QA records
2.Small package size
Small size; 1.2 x 1.2mm
3.Prevent malfunction caused by noise
Low inductance; L＝0.01nH |
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VDS=40V-60V
| Parts number |
Data sheet |
Type |
VDS
[V] |
VGS
[V] |
ID*1
[A] |
Rds(on)Typ.[mΩ] |
Package Size |
VGS
10V |
VGS
4.5V |
x[mm] |
y[mm] |
t[μm] |
| FK9B0439ZL |
|
N-Single |
40 |
+20/-10 |
11.0 |
9.50 |
11.0 |
1.94 |
1.94 |
100 |
| KFK9B0463ZL |
|
N-Single |
40 |
+20/-10 |
10.8 |
11.0 |
16.0 |
3.05 |
3.05 |
500 |
| KFK4B40028NU |
|
N-Single |
40 |
+20/-10 |
5.5 |
25.0 |
31.0 |
1.20 |
1.20 |
100 |
| KFK9B0652ZL |
|
N-Single |
60 |
+20/-10 |
8.3 |
18.0 |
20.0 |
1.94 |
1.94 |
100 |
| KFK4B0613ZL |
|
N-Single |
60 |
+20/-10 |
3.5 |
57.0 |
63.0 |
1.20 |
1.20 |
100 |
| KFJ9B0458ZL |
|
P-Single |
-40 |
-20/+10 |
-11.6 |
10.0 |
12.0 |
3.05 |
3.05 |
100 |
| KFJ9B0438ZL |
|
P-Single |
-40 |
-20/+10 |
-7.8 |
20.0 |
23.0 |
2.14 |
2.14 |
100 |
| KFJ9B0466ZL |
|
P-Single |
-40 |
-20/+10 |
-7.0 |
27.0 |
30.0 |
3.05 |
3.05 |
500 |
| KFJ4B0421ZL |
|
P-Single |
-40 |
-20/+10 |
-3.2 |
74.0 |
83.0 |
1.20 |
1.20 |
100 |
| KFJ9B0639ZL |
|
P-Single |
-60 |
-20/+10 |
-7.5 |
24.0 |
26.0 |
3.05 |
3.05 |
100 |
| KFJ4B0622ZL |
|
P-Single |
-60 |
-20/+10 |
-3.8 |
56.0 |
60.0 |
2.00 |
2.00 |
100 |
＊1 FR4 board (25.4mm×25.4mm×t1.0mm), Full Cu
粤公网安备 44030502010001号