Häufig gestellte Fragen
- M051-Base-Serie(95)
- M0518-Serie(97)
- M0519-Serie(43)
- M0564-Serie(1)
- Mini51-Base-Serie(90)
- Nano100/102-Base-Serie(101)
- Nano103-Base-Serie(10)
- Nano110/112-LCD-Serie(100)
- Nano120-USB-Serie(111)
- Nano130-Advanced-Serie(110)
- NUC029-Serie(94)
- NUC100/200-Advanced-Serie(102)
- NUC120/122/123/220-USB-Serie(116)
- NUC121/125-Serie(1)
- NUC126-USB-Serie(2)
- NUC130/230-CAN-Serie(103)
- NUC131-NUC1311-CAN-Serie(98)
- NUC140/240-Konnektivität-Serie(114)
- M451-Base-Serie(118)
- M451M-Serie(117)
- M452-USB-Serie(130)
- M4521 USB Serie(1)
- M453-CAN-Serie(128)
- M463 CAN FD/USB HS Series(1)
- M467 Ethernet/Crypto Series(1)
- M471 Series(1)
- M479 Motor Control Series(1)
- M481-Base-Serie(4)
- M482-USB-FS-OTG-Serie(4)
- M483-CAN-Serie(4)
- M484-USB-HS-OTG-Serie(4)
- M485-Crypto-Serie(4)
- M487-Ethernet-Serie(4)
- M4TK-Touch-Key-Serie(25)
- NUC442/472-Serie(130)
- NUC472 Series(1)
- NUC505-Serie(138)
产品
功能
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FAQ
What needs to be considered when soldering components in the production process? Issue Date:2015-03-20
In general, it is suggested to use flux rather than solder paste when soldering components. After soldering is completed, alcohol or cleaning agent can be used to remove residual flux residues to avoid problems caused by a short circuit.